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Analog Technologies SMT production floor2

Our Capabilities

Our extensive knowledge and capabilities allow us to develop, tailor, and optimize processes specifically for your applications.

Our Capabilities include:

  • Surface Mount Lines (SMT)

    • Stencil Printing

    • Jet Printing

    • Package on Package

    • Advanced Component Packages

    • Package sizes down to 01005

    • Convection Reflow

    • Vapor Phase Soldering

  • Selective Thru Hole Soldering

  • Manual / Hand Soldering

  • Conformal Coating: Epoxies, Urethanes, and Acrylics

  • Encapsulation

  • Underfilling

  • Low-Pressure Overmolding

  • Functional Testing

  • Flying Probe Testing and Troubleshooting

  • Thermal Chamber – Environmental Stress Screening (ESS)

  • Vacuum Chamber

  • Wire/Cable Assembly

  • Box Build

  • Wire bonding

  • Die Attach

  • Silver Sintering

  • Plasma Cleaning

  • Advanced package assembly

    • Including Fine pitch, COB (Chip-on-board), COF (Chip on Flex), BGA, QFN, LGA, DFN, CSP, uBGA, Flip Chip, PoP (Package on Package), Copper Pillar (Cu Pillar), System on Chip (SoC), and many others

  • Custom rework, repair, and modification

  • Mechanical Assembly

  • Clean Room Assembly

  • Microscopic assembly

  • Machining and Fabrication: for custom and rapid deployment of production tools and fixtures

  • 3D Printing

  • Specialty Rework and Repair

  • X-Ray Imaging and Analysis

  • Multiple Soldering Alloys, Fluxes, and Materials Supported

  • Product serialization and material traceability

  • IPC Class 2, 3 workmanship levels

Don’t see what you need?  This is just a partial list of our capabilities.  Contact us to discuss how we can help you with your electronic manufacturing challenges.

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Why Choose Us?

Long-term customer relationships

Broad base of engineering and manufacturing expertise

Collaborative, flexible and solutions oriented

Located minutes from Minneapolis St. Paul International Airport

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