Our Capabilities

Our Capabilities include:

• Surface Mount Lines (SMT)

  • Stencil Printing

  • Jet Printing

  • Package on Package

  • Advanced Component Packages

  • Package sizes down to 01005

  • Convection Reflow

  • Vapor Phase Soldering

• Selective Thru Hole Soldering

• Manual / Hand Soldering

• Conformal Coating: Epoxies, Urethanes, and Acrylics

• Encapsulation

• Underfilling

• Low-Pressure Overmolding

• Functional Testing

• Flying Probe Testing and Troubleshooting

• Thermal Chamber – Environmental Stress Screening (ESS)

• Vacuum Chamber

• Wire/Cable Assembly

• Box Build

• Wire bonding

• Die Attach

• Silver Sintering

• Plasma Cleaning

• Advanced package assembly

  • Including Fine pitch, COB (Chip-on-board), COF (Chip on Flex), BGA, QFN, LGA, DFN, CSP, uBGA, Flip Chip, PoP (Package on Package), Copper Pillar (Cu Pillar), System on Chip (SoC), and many others

• Custom rework, repair, and modification

• Mechanical Assembly

• Clean Room Assembly

• Microscopic assembly

• Machining and Fabrication: for custom and rapid deployment of production tools and fixtures

• 3D Printing

• Specialty Rework and Repair

• X-Ray Imaging and Analysis

• Multiple Soldering Alloys, Fluxes, and Materials Supported

• Product serialization and material traceability

• IPC Class 2, 3 workmanship levels