Advanced Packaging and Interconnects
Specialized semiconductor packaging and high-performance interconnect solutions for demanding aerospace, defense, power, and sensor applications.
High-Performance Packaging and Interconnects
Overview
Advanced Packaging and Interconnects Capabilities
Advanced packaging and interconnect solutions that enable next-generation electronic assemblies for demanding applications.
Wire Bonding
Wire bonding creates fine electrical connections between die and substrate, enabling compact multi-die and chip-scale assemblies for high-frequency and high-reliability applications.
- Ball bonding
- Thermosonic bonding
- Aluminum and gold wire bonding
- Multi-die interconnect
- Wire pull and shear validation per program requirements
Silver Sintering
Silver sintering provides superior thermal conductivity die attachment for power electronics and applications where traditional solder attachment requires an upgrade in thermal dissipation performance.
- Silver sintered die bonding
- High thermal conductivity attachment
- Power semiconductor packaging
- Baseplate and DBC substrate integration
Advanced Interconnect
Our advanced interconnect services support miniaturized and high-density assembly formats for space-constrained and high-performance applications.
- Flip-chip assembly
- Package-on-Package (PoP)
- Copper pillar (Cu Pillar) interconnect
- Chip-on-Board (COB)
- Chip-on-Flex (COF)
Why Analog for Advanced Packaging
Specialized Engineering Expertise
A dedicated engineering team with deep semiconductor packaging experience, providing process development support from early design through production release.Validated Bond Integrity
Wire pull and shear validation confirms bond quality on every program, ensuring assemblies meet the reliability requirements of aerospace, defense, medical, and power electronics applications.Compliance Built In
ITAR registered for controlled programs and Nadcap accredited for special process compliance, supporting customers with strict regulatory and quality requirements.
Ready to Get Started?
Starting a new program is simple. Here is how it works.
Submit Your Project Details
Share your design files, specifications, volumes, and timeline.]
Engineering Review & Quote
Our engineers review your submission for manufacturability, flag any considerations, and return a detailed quote with lead times and process notes.
Build, Test & Deliver
Your assembly is built to your specification, inspected and tested to IPC Class 2 or Class 3 standards, and shipped with complete documentation and traceability records.
Let’s get started—Request a quote today!
Get StartedIndustries Rely on Analog Technologies for Advanced Packaging and Interconnects
We support a range of technology-driven industries, ensuring mission-critical performance and regulatory compliance in even the most demanding environments.
Military and Defense
Industrial Equipment
Aerospace
Critical Power
Built to the Highest Industry Standards
Quality is at the core of everything we do. Our certifications and compliance standards ensure repeatable, reliable performance you can trust.
Every board undergoes rigorous inspection and functional testing to ensure flawless performance and durability.
Process Controls:
- IPC Class 2 and 3 workmanship
- Full product serialization
- Material traceability from receiving through shipment
- SPC, FMEA, and lean manufacturing practices
- IPC 600 and IPC 610 Registered Trainers on staff
Validated special processes for aerospace and defense.
Aerospace and defense quality management standard.
Certified quality management system.
Compliant with U.S. defense manufacturing regulations.
