Laser Soldering Service - Laser Balling and Re-balling. Heat just where you need it.

Laser Soldering Services

Many materials and components cannot endure the stress of elevated temperatures. For conventional reflow processing, materials and components may experience temperatures above 220 °C. In 2003, Analog began working on solutions to attach components in applications that could not withstand these temperatures. As a result, Analog developed it’s own proprietary laser soldering machine. Once the laser soldering machine was realized, other applications were addressed including laser balling and re-balling.

Laser Balling and Re-balling
	Re-ball BGAs or CSPs without sacrificing heat cycles Maintain component reliability Improved solder joint quality Lead-free to lead/lead and lead/lead to lead-free conversions

	Convection Reflow: Solder Balls attached in a convection oven with nitrogen. Irregular shape is caused by some oxygen presence(~75 ppm).	Laser Reflow: Typical untouched pristine appearance of laser-reflowed solder balls re-balled using proprieatary process on the same BGA.
BGA and CSP ball repair
Selective Soldering Applications
	Low Tg materials
	Temperature sensitive components
Fully Characterized and Qualified Process
Fast Turn Service Available



NEWS
Analog’s Laser Balling and Re-balling process is featured in Circuits Assembly’s Oct-2008 issue!
Click Here
Entire Article in PDF

Take advantage of this unique capability. Contact us today to discuss your particular application or processing issue.

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