The Industry’s High Tech Leader Since 1993
Our experienced engineers are committed to your process innovation.

Our capabilities include:
  • PCB assembly of diverse component packages
  • Surface Mount (SMT) and thru-hole production processes and development
  • Conformal Coating
  • PCBA and system testing including Flying Probe
  • Software installation (component, firmware and application)
  • Wirebond and Die Attach
  • Silver Sintering
  • Advanced package assembly including Fine pitch, COB (Chip-on-board), COF (Chip on Flex), BGA, QFN, LGA, DFN, CSP, uBGA, Flip Chip, PoP (Package on Package), and others
  • Cable and Wire Harness Assembly
  • Custom rework, repair, and modification
  • Failure analysis
  • Materials management
  • Product serialization and material traceability
  • International logistics

We’re ready to help with the following services:

Get the most out of your first run, we provide feedback based on the build and you get rapid form, fit and function.

New Product Introductions
We establish and fine-tune manufacturing processes and will assist in transferring to a high-volume facility.

For the right families of products we can be globally competitive in production.

Markets served:
  • Aerospace
  • Military / Defense
  • High Reliability
  • Commercial
  • Industrial
  • Other