The Industry’s High Tech Leader Since 1993
Our experienced engineers are committed to your process innovation.
Our capabilities include:
- PCB assembly of diverse component packages
- Surface Mount (SMT) and thru-hole production processes and development
- Conformal Coating
- PCBA and system testing including Flying Probe
- Software installation (component, firmware and application)
- Wirebond and Die Attach
- Silver Sintering
Advanced package assembly including Fine pitch, COB (Chip-on-board), COF (Chip on Flex), BGA, QFN, LGA, DFN, CSP, uBGA, Flip Chip, PoP (Package on Package), and others
- Cable and Wire Harness Assembly
- Custom rework, repair, and modification
- Failure analysis
- Materials management
- Product serialization and material traceability
- International logistics
We’re ready to help with the following services:
Prototypes
Get the most out of your first run, we provide feedback based on the build and you
get rapid form, fit and function.
New Product Introductions
We establish and fine-tune manufacturing processes and will assist in transferring
to a high-volume facility.
Production
For the right families of products we can be globally competitive in production.
Markets served:
Aerospace
Military / Defense
High Reliability
Commercial
Industrial
Other
